Polishing Cloths and Polishing Pads
Polishing cloths and polishing pads for ultra-precision polishing are essential for the manufacture of silicon wafers and photomasks. The results of our research on wet-method microporous membrane formation and foaming by RIM have been utilized to achieve high-precision smoothness.
Toray Coatex Co., Ltd.

RAYNOS™
Suede type
- Features
- Various products are available, including non-woven fabric base material products, PET film base material products, and separate urethane nap (polishing layer) products
- Suede pad based on high-precision microfiber non-woven fabrics provides good cushioning and high in-plane uniformity
- For final polishing with a balanced polishing rate and scratch-removing performance

RAYNOS™
Hard urethane foam type
- Features
- Various non-filler and built-in filler type products are available
- For stock removal polishing and final polishing of optical lenses, glass substrates and other materials

RAYNOS™
Urethane-impregnated non-woven fabric type
- Features
- High polishing rate, oxidation resistance and optimized roll-off
- For stock removal polishing of compounds such as SiC and Si wafers
Buffer Coating Materials
Heat-resistant polyimide-based coating materials with excellent electric insulation and mechanical properties. Photodefinable and non-photodefinable types are available.

- Features
- Highly reliable in terms of heat resistance, mechanical properties, dielectric strength and chemical resistance
- World-class photosensitivity and high patterning dimensional stability
- A diverse photodefinable-type product lineup with positive-tone and negative-tone models for various applications and processes

- Features
- Highly reliable in terms of heat resistance, mechanical properties, dielectric strength and chemical resistance
- Heat resistance of 500°C or above
- A diverse non-photodefinable-type product lineup for various patterning processes and applications (low CTE products and products that support thin film/thick film formation)
Semiconductor Inspection Systems
Our semiconductor inspection systems provide high-precision, high-speed inspection covering the entire semiconductor manufacturing process, from front-end to back-end processes. TASMIT’s own algorithms help reduce defects and improve yields.

- Features
- Improved inspection performance and enhanced system reliability and usability compared to conventional models
- High-sensitivity detection of fine defects with DSI (Die to Statistical Image) algorithms
- High-magnification inspection achieves twice the inspection speed of conventional models

NGR5000 Series
- Features
- Compatible with NAND memory semiconductors, DRAM memory semiconductors and logic semiconductors
- Differences between circuit design patterns and transferred circuits are measured using electron microscopes
- High-quality images of increasingly multilayered devices are acquired with high-acceleration electron microscope
- High-speed inspection is achieved by acquiring low-distortion images with a wide field of view.

NGR3500 Series
- Features
- Wide field of view electron microscope image is used for Die to Database measurement and inspection
- High-precision comparison of acquired images and design data is performed for inspection and measurement
- High-sensitivity inspection of pattern defects and 2D massive measurement of pattern dimensions are performed at high speed
Electron Beam Parts
Essential parts for laboratory instruments and equipment that handle input at an electronic level. Ultra-micro-hole machining improves the convergence of electrons as well as the accuracy of emitted electrons.

- Features
- Metal parts of semiconductor manufacturing equipment and electron microscopes that are mainly used in the front-end process (such as mask/wafer inspection systems, drawing equipment and exposure equipment)
- Compatible with various materials, including minor metals such as molybdenum, tungsten and titanium
- High-precision machining
- Finished for use in vacuum environments
Impurity and Dopant Analysis
The analyzer with the best spatial analytical capabilities for SIMS (secondary ion mass spectrometry), which offers both high sensitivity and high mass resolution.

- Features
- High spatial resolution down to 50 nm for imaging analysis and depth profile analysis of microscopic regions
- Compatible with high-sensitivity measurement for detection of impurities
- The only equipment that can provide commercial NanoSIMS measurement in Japan
Oxide Film and Insulating Film Analysis
An analyzer that provides multifaceted evaluation of the SiO2 film deposition process and guidance for process optimization.

(Mercury probes, RBS, XPS, FT-IR)
- Features
- Comprehensive analysis that combines various analytical methods (ex. FT-IR, RBS, XPS, mercury probe method, etc.)
- Detailed analysis of insulating film quality through complementary evaluation of electrical properties and physical analysis
- Contributes to improved reliability of insulating films and acquisition of guidelines for optimizing the deposition process
Materials for redistribution layer (RDL) (Polyimide Resin)
We offer a range of heat-resistant polyimide resin materials in sheet and varnish types with low-temperature curability, excellent mechanical properties, and good adhesion to metal wiring.

- Features
- Compatible with low-temperature curing (<230°C)
- Highly reliable materials with excellent heat resistance, mechanical properties, dielectric strength and chemical resistance
- The positive-tone photodefinable type offer world-class resolutions, while the negative-tone type can be used for thick film formation

- Features
- Film-like adhesive provides uniform film thickness
- Highly reliable in terms of heat resistance, mechanical properties, dielectric strength and chemical resistance, with excellent penetration properties
- A diverse product lineup for various applications and processes (epoxy/polyimide types (photodefinable/non-photodefinable))
Antistatic ABS Resin
Antistatic ABS resins are used to suppress static electricity in a variety of situations, such as on transport materials in semiconductor manufacturing processes. ABS resins developed using Toray's polymer technology offer a sustainable and stable static dissipation feature.

- Features
- The antistatic performance of the dust- and lint-resistant resins is not reduced even after multiple uses
- Prevents electrostatic discharge damage and adhesion of electronic components caused by static electricity
- All colors and transparency levels are supported
- The risk of carbon falling off is reduced
PPS Resin for 3D Printers
Fine polyphenylene sulfide (PPS) resin particles for 3D printing. Toray's unique polymer design technology provides the best fluidity and polymer properties for powder bed fusion (PBF method).

- Features
- Prototype parts for functional verification and low-volume final parts or spare parts can be provided with short delivery times at low cost
- Complex-shaped parts can be provided using PPS with excellent heat resistance, chemical resistance, insulation properties and flame retardance (PA6 is also available)
- Parts can also be supplied by 3D printing service providers
PPS Resin
PPS resin is a crystalline thermoplastic engineering plastic with great heat resistance, chemical resistance and dimensional stability. It is used in power semiconductor module cases and terminal blocks.

- Features
- Heat resistance and strength that withstand the heat generation of semiconductor elements and external impact (thin-walled resin with a UL 94 flammability rating of V-0 and RTI 150°C or higher)
- Excellent dimensional stability and heat cycle resistance make it suitable for in-vehicle environments. Ideal for PCU and small case applications for xEV where insert molding for terminals is necessary. Good flowability allows for complex thin-walled designs
- Grades with high tracking resistance and CTI ranking of ≥600 V can be used in high-voltage power semiconductor cases for railways and power plants. In automotive applications, the creepage distance can be shortened while maintaining insulation by using high-tracking-resistance resin
Dicing Films
The categories of base materials for dicing tape and pressure-sensitive type dicing tape made from extruded films are available for product proposals.

- Features
- Burr-resistant dicing tape base material (PO type)
- Dicing tape base material for wafers (PO type)
- Alternative base material for PVC (polyvinyl chloride) (PO type)
- Self-adhesive pressure-sensitive dicing tape made from extruded films (PO type, solvent-free, plasticizer-free, non-separator)
Mold Release Films
Non-silicone, non-fluorine and non-halogen-based mold release films with excellent mold ability for the semiconductor molding process.

- Features
- Non-silicone, non-fluorine and non-halogen with excellent mold ability.
- High formability for mold chase
- Less mold chase pollution
- High strength and tear-resistant thin film can be produced in longer length
High-Precision Bonders (Flip Chip Bonders/Die Bonders)
High-precision flip chip bonders for the semiconductor packaging process. We offer equipment for a wide range of applications, from R&D to mass production. A variety of bonders are available for 2.5D/3D packaging, FOWLP and PLP.

FC3000W
- Features
- TCB equipment for COW suitable for applications from R&D to mass production
- High precision (<±1.5 μm) and suitable for high pressure force (490 N)

FC6000H
- Features
- For high-end application processors
- Both high precision (<±2 μm) and high UPH

MD5000/MD5000T
- Features
- Die bonder/flip chip bonder for panel level packaging (PLP)
- High precision (<±1 μm)
Laser Trimming Equipment
Laser ablation enables pattern processing and contaminant removal on glass substrates and wafers.

LMT-TR
- Features
- Trimming/transfer/metal cutting equipment for micro-LEDs
- Laser wavelengths can be switched depending on the work material
- Laser spot size can be changed from 2 to 300 μm

LMT-HR
- Features
- Laser fuse cutting equipment for analog semiconductors
- High-accuracy alignment (<±0.2 μm) equipment
- Substrate sizes from 4 to 12 inches are supported
Ultrasonic Transducers
We have a proven track record of the equipment being adopted as a Scanning Acoustic Tomograph sensor for non-destructive and non-contact internal defect inspection of semiconductor chip packages.

- Features
- Supports a wide range of frequency bands from 20 MHz to 150 MHz, which are required in the semiconductor field
- High-precision output can be obtained by using Toray's unique polymer piezoelectric P (VDF-TrFE) film
- Pulser receivers, which are modules for sending and receiving pulse signals, are also available
Vacuum Resin Injectors
Ideal for case-type modules and direct potting resin sealing. The equipment supports a wide range of resin properties, from high to low viscosity. It injects two-part epoxy resin into the target workpiece inside the vacuum chamber.
Toray Engineering P Frontier Co., Ltd.

Vacuum Resin Injectors
- Features
- Defoaming of resin is performed by stirring the resin under high vacuum
- A thin film defoaming tank has been developed for resins that are difficult to defoam, providing high-speed defoaming
- Resin is molded via a sequence of manufacturing processes of vacuum defoaming by stirring -> weighing of two agents -> mixing -> vacuum injection
- Automatic vacuum defoaming can be performed before stirring and mixing the main agent and curing agent of the epoxy resin
- High-precision, wear-resistant ceramic pumps for long-term stable injection volumes
Dispenser Nozzles
Utilizing the processing technologies and experience from manufacturing our synthetic fiber spinning nozzles, we are able to design and manufacture high-precision, high-quality nozzles that are ideal for various applications and liquids.

- Features
- Nozzle discharge performance is improved through design and machining that takes the viscosity and surface tension of the liquid into account
- Holes can be machined in various shapes, including circular, formed and pipe-shaped
- Multi-nozzles with multiple application points are also supported
in-situ Heating TEM
Structural changes during heating can be observed by in-situ TEM using dedicated sample holders.

- Features
- Thermal behaviors resulting from heat treatment can be directly observed with high resolution using in-situ Heating TEM holders
- Wide temperature range from room temperature to 1,300℃
- Precise temperature and time control via the program
Thermal Characterization
We provide technologies that accurately evaluate thermal properties of various materials and devices.

- Features
- Used for high-precision product design and simulation, troubleshooting, and more
- High-precision thermal characterization (thermal conductivity, thermal expansion and thermal strain) of actual products with the latest equipment
- Amorphous and composite materials such as soft and semi-solid materials can also be measured
Machining Part Materials (PPS/PEEK/PAI Rods and Plates)
In order to achieve cutting machining with high precision and high efficiency, we offer a wide range of products that can be adapted to the required specifications, from hardness and wear resistance to high heat resistance and chemical resistance.

Plastic Materials
- Features
- High dimensional stability due to the material's low linear expansion coefficient and low water absorption
- Excellent chemical resistance to organic solvents, strong inorganic acids and strong alkalis
- Lower cost than PEEK when the use with hot water is not required
- Alternative materials for PFAS can be proposed

Plastic Materials
- Features
- Excellent high temperature water resistance for continuous use in steam from 200℃ to 260℃
- Extremely high chemical resistance to acids and alkalis in high-temperature conditions
- High combustibility, so very little smoke or toxic gases are generated by combustion

Plastic Materials
- Features
- Highest mechanical strength in non-filled (non-reinforced) plastics
- Self-lubricating and can be used as a sliding part without a lubricant at high temperatures above 200℃
- Excellent abrasion resistance at temperatures up to 200℃
- Used for applications such as inspection and reliability testing device sockets and jigs, and burn-in reliability testing
Cleaning Cloths
To achieve the high level of cleanliness for production and inspection processes, microfibers with a diameter of 2 microns create a structure with a high number of fibers and gaps per unit area.

- Features
- Excellent wiping performance with our special microfibers
- Low level of dust generation and high lint-free capacity
- High cleanliness with special heat cutting process and washing process
- High level of water and oil absorption by capillary action
Resist Removal Solvents (DMSO)
DMSO is a highly safe aprotic polar solvent that dissolves most organic and inorganic compounds. It is used as a cleaning solution and releasing agent for semiconductors and electronic components.

- Features
- The content of metal impurities is controlled with the most stringent levels in the world
- Proven track record of adoption in many semiconductor applications
Semiconductor Inspection Systems (Wafer Inspection System/Luminescence Defect Inspection System)
The INSPECTRA™ Series enables high-speed, high-sensitivity inspection of all wafers, from front-end to back-end processes in semiconductor manufacturing. The INSPECTRA™ PL Series automatically detects crystal defects, cracks and luminescence defects that were not visible in visible light appearance inspection.

INSPECTRA™Series
- Features
- Improved inspection performance and enhanced system reliability and usability compared to conventional models
- High-magnification inspection achieves twice the inspection speed of conventional models
- A wide range of products are available, including types that support wafer inspection after dicing

INSPECTRA™ PL Series
- Features
- Crystal defects are detected and classified at high speed and with high sensitivity using TASMIT’s own optical systems and inspection algorithms
- The system can even be used for pattern process
- Killer defects can be detected with combined visible light inspection and PL inspection

INSPECTRA™ IR Series
- Features
- The system can be used for both infrared and visible light defect inspections
- High-sensitivity detection of fine defects DSI (Die to Statistical Image) algorithms
- For infrared light inspection, the use of high-sensitivity cameras speeds up wafer internal inspection
- Visible light inspection is also available for a wide range of inspection needs

OM-7000H
- Features
- High-precision measurement of wafer bonding misalignment and top-to-bottom alignment of wafers
- Fully automatic measurement
- Supports both transmission and reflection measurements
Oxygen Analyzer
Toray's unique zirconia sensor technology provides accurate and reliable measurement of oxygen concentration. A wide range of oxygen concentrations from trace oxygen to 100% can be monitored in the manufacturing device chamber processing room.

- Features
- Multi-point measurement is supported, enabling simultaneous measurement at up to 8 points
- Concentration can be displayed at ppm levels
- The sampling method is compatible with pump suction types and diffuse types used for vacuum measurement
- The oxygen sensor is specially processed for greater durability

- Features
- Supports a wide range of measurements from ppm levels to 100%
- The oxygen sensor is specially processed for greater durability against sensor deterioration
Inkjet Nozzles/ Vacuum Plates/Apertures,
Orifices and Collimators
We custom manufacture a variety of precision hole processing parts, such as inkjet nozzles, vacuum plates, apertures, collimators and orifices, which are essential for semiconductor manufacturing processes.

- Features
- Machining of small diameter holes for high-definition coating (minimum hole diameter: Ø0.1 μm)
- Machining accuracy at the sub-micron scale
- Smooth finishing of internal hole surfaces at nano-scale surface roughness
- Custom manufacturing of your desired hole shape

- Features
- High-precision micro-holes, positional accuracy and high flatness for uniform suction
- Suction marks and wrinkles on products can be prevented
- Custom-made, flexible design for suction areas

- Features
- Supports deep hole machining of ultra-micro holes (example: hole diameter Ø0.003 mm and thickness 0.010 mm)
- Supports hole diameters from Ø0.1 μm
- Compatible with various materials including minor metals such as molybdenum, tungsten, titanium and tantalum
Production Management System
A production management system created through resolving Toray Group's manufacturing site challenges. By sharing a wide variety of data on production activities, it supports planning, execution and evaluation.

TONOPS™ Production Management System
- Features
- Semi-packaged system with a wide variety of templates
- Detailed and flexible customization
- Integration with various production plants and automation equipment is supported
Water Treatment Membranes
We provide comprehensive water treatment solutions utilizing the latest products and technologies in brackish water treatment, seawater desalination, wastewater reclamation and various special applications.

- Features
- High neutral molecule rejection (boron, silica, etc.) (TBW-HR Series)
- A wide range of products are available for various processes (high rejection model, energy saving model, etc.)

- Features
- Toray's proprietary membrane fabrication technology achieves high permeability (small footprint) high mechanical strength and high durability (long life)
- Nominal pore size of 0.01 μm enables effective removal of suspended solids and microorganisms

- Features
- Better quality of treated water and significantly smaller footprint compared to the conventional activated sludge treatment process
- NHP210 and NHPA Series that use flat sheet membrane elements without supporting plates
- Module weight reduction and high membrane packing density (space saving) due to the improvement of flat sheet membrane elements
Pure Water TOC Analyzer
Fast, accurate automated measurement of total organic carbon in pure water. The analyzer is used to determine the reusability of pure water used in the cleaning process and control the water quality of pure water in semiconductor manufacturing processes.

- Features
- High-speed response (90% response within five minutes) with continuous measurement using wet UV oxidation/CO2 detection system
- The auto zero and automatic diagnosis functions enable stable measurements over the long-term