Products

Polishing Cloths and Polishing Pads

Polishing cloths and polishing pads for ultra-precision polishing are essential for the manufacture of silicon wafers and photomasks. The results of our research on wet-method microporous membrane formation and foaming by RIM have been utilized to achieve high-precision smoothness.

RAYNOS™Suede type

RAYNOS™
Suede type

Features
Various products are available, including non-woven fabric base material products, PET film base material products, and separate urethane nap (polishing layer) products
Suede pad based on high-precision microfiber non-woven fabrics provides good cushioning and high in-plane uniformity
For final polishing with a balanced polishing rate and scratch-removing performance
RAYNOS™Hard urethane foam type

RAYNOS™
Hard urethane foam type

Features
Various non-filler and built-in filler type products are available
For stock removal polishing and final polishing of optical lenses, glass substrates and other materials
RAYNOS™Urethane-impregnated non-woven fabric type

RAYNOS™
Urethane-impregnated non-woven fabric type

Features
High polishing rate, oxidation resistance and optimized roll-off
For stock removal polishing of compounds such as SiC and Si wafers

Buffer Coating Materials

Heat-resistant polyimide-based coating materials with excellent electric insulation and mechanical properties. Photodefinable and non-photodefinable types are available.

PHOTONEECE™
PHOTONEECE™
Features
Highly reliable in terms of heat resistance, mechanical properties, dielectric strength and chemical resistance
World-class photosensitivity and high patterning dimensional stability
A diverse photodefinable-type product lineup with positive-tone and negative-tone models for various applications and processes
SEMICOFINE™
SEMICOFINE™
Features
Highly reliable in terms of heat resistance, mechanical properties, dielectric strength and chemical resistance
Heat resistance of 500°C or above
A diverse non-photodefinable-type product lineup for various patterning processes and applications (low CTE products and products that support thin film/thick film formation)

Semiconductor Inspection Systems

Our semiconductor inspection systems provide high-precision, high-speed inspection covering the entire semiconductor manufacturing process, from front-end to back-end processes. TASMIT’s own algorithms help reduce defects and improve yields.

Wafer Inspection System INSPECTRA™ Series
Wafer Inspection System INSPECTRA™ Series
Features
Improved inspection performance and enhanced system reliability and usability compared to conventional models
High-sensitivity detection of fine defects with DSI (Die to Statistical Image) algorithms
High-magnification inspection achieves twice the inspection speed of conventional models
Wafer Geometry Verification System NGR5000 Series
Wafer Geometry Verification System
NGR5000 Series
Features
Compatible with NAND memory semiconductors, DRAM memory semiconductors and logic semiconductors
Differences between circuit design patterns and transferred circuits are measured using electron microscopes
High-quality images of increasingly multilayered devices are acquired with high-acceleration electron microscope
High-speed inspection is achieved by acquiring low-distortion images with a wide field of view.
Wafer Geometry Verification System NGR3500 Series
Wafer Geometry Verification System
NGR3500 Series
Features
Wide field of view electron microscope image is used for Die to Database measurement and inspection
High-precision comparison of acquired images and design data is performed for inspection and measurement
High-sensitivity inspection of pattern defects and 2D massive measurement of pattern dimensions are performed at high speed

Electron Beam Parts

Essential parts for laboratory instruments and equipment that handle input at an electronic level. Ultra-micro-hole machining improves the convergence of electrons as well as the accuracy of emitted electrons.

Electron Beam Parts
Electron Beam Parts
Features
Metal parts of semiconductor manufacturing equipment and electron microscopes that are mainly used in the front-end process (such as mask/wafer inspection systems, drawing equipment and exposure equipment)
Compatible with various materials, including minor metals such as molybdenum, tungsten and titanium
High-precision machining
Finished for use in vacuum environments

Impurity and Dopant Analysis

The analyzer with the best spatial analytical capabilities for SIMS (secondary ion mass spectrometry), which offers both high sensitivity and high mass resolution.

Nano-SIMS
Nano-SIMS
Features
High spatial resolution down to 50 nm for imaging analysis and depth profile analysis of microscopic regions
Compatible with high-sensitivity measurement for detection of impurities
The only equipment that can provide commercial NanoSIMS measurement in Japan

Oxide Film and Insulating Film Analysis

An analyzer that provides multifaceted evaluation of the SiO2 film deposition process and guidance for process optimization.

Electrical and physical complementary analysis of SiO<sub>2</sub> film (Mercury probes, RBS, XPS, FT-IR)
Electrical and physical complementary analysis of SiO2 film
(Mercury probes, RBS, XPS, FT-IR)
Features
Comprehensive analysis that combines various analytical methods (ex. FT-IR, RBS, XPS, mercury probe method, etc.)
Detailed analysis of insulating film quality through complementary evaluation of electrical properties and physical analysis
Contributes to improved reliability of insulating films and acquisition of guidelines for optimizing the deposition process

Materials for redistribution layer (RDL) (Polyimide Resin)

We offer a range of heat-resistant polyimide resin materials in sheet and varnish types with low-temperature curability, excellent mechanical properties, and good adhesion to metal wiring.

PHOTONEECE™
PHOTONEECE™
Features
Compatible with low-temperature curing (<230°C)
Highly reliable materials with excellent heat resistance, mechanical properties, dielectric strength and chemical resistance
The positive-tone photodefinable type offer world-class resolutions, while the negative-tone type can be used for thick film formation
FALDA™
FALDA™
Features
Film-like adhesive provides uniform film thickness
Highly reliable in terms of heat resistance, mechanical properties, dielectric strength and chemical resistance, with excellent penetration properties
A diverse product lineup for various applications and processes (epoxy/polyimide types (photodefinable/non-photodefinable))

Antistatic ABS Resin

Antistatic ABS resins are used to suppress static electricity in a variety of situations, such as on transport materials in semiconductor manufacturing processes. ABS resins developed using Toray's polymer technology offer a sustainable and stable static dissipation feature.

TOYOLACPAREL™
TOYOLACPAREL™
Features
The antistatic performance of the dust- and lint-resistant resins is not reduced even after multiple uses
Prevents electrostatic discharge damage and adhesion of electronic components caused by static electricity
All colors and transparency levels are supported
The risk of carbon falling off is reduced

PPS Resin for 3D Printers

Fine polyphenylene sulfide (PPS) resin particles for 3D printing. Toray's unique polymer design technology provides the best fluidity and polymer properties for powder bed fusion (PBF method).

Toraymill™ PPS
Toraymill™ PPS
Features
Prototype parts for functional verification and low-volume final parts or spare parts can be provided with short delivery times at low cost
Complex-shaped parts can be provided using PPS with excellent heat resistance, chemical resistance, insulation properties and flame retardance (PA6 is also available)
Parts can also be supplied by 3D printing service providers

PPS Resin

PPS resin is a crystalline thermoplastic engineering plastic with great heat resistance, chemical resistance and dimensional stability. It is used in power semiconductor module cases and terminal blocks.

PPS Resin TORELINA™
PPS Resin TORELINA™
Features
Heat resistance and strength that withstand the heat generation of semiconductor elements and external impact (thin-walled resin with a UL 94 flammability rating of V-0 and RTI 150°C or higher)
Excellent dimensional stability and heat cycle resistance make it suitable for in-vehicle environments. Ideal for PCU and small case applications for xEV where insert molding for terminals is necessary. Good flowability allows for complex thin-walled designs
Grades with high tracking resistance and CTI ranking of ≥600 V can be used in high-voltage power semiconductor cases for railways and power plants. In automotive applications, the creepage distance can be shortened while maintaining insulation by using high-tracking-resistance resin

Dicing Films

The categories of base materials for dicing tape and pressure-sensitive type dicing tape made from extruded films are available for product proposals.

TOREVAS™
TOREVAS™
Features
Burr-resistant dicing tape base material (PO type)
Dicing tape base material for wafers (PO type)
Alternative base material for PVC (polyvinyl chloride) (PO type)
Self-adhesive pressure-sensitive dicing tape made from extruded films (PO type, solvent-free, plasticizer-free, non-separator)

Mold Release Films

Non-silicone, non-fluorine and non-halogen-based mold release films with excellent mold ability for the semiconductor molding process.

CERAPEEL™
CERAPEEL™
Features
Non-silicone, non-fluorine and non-halogen with excellent mold ability.
High formability for mold chase
Less mold chase pollution
High strength and tear-resistant thin film can be produced in longer length

High-Precision Bonders (Flip Chip Bonders/Die Bonders)

High-precision flip chip bonders for the semiconductor packaging process. We offer equipment for a wide range of applications, from R&D to mass production. A variety of bonders are available for 2.5D/3D packaging, FOWLP and PLP.

Flip Chip Bonder FC3000W
Flip Chip Bonder
FC3000W
Features
TCB equipment for COW suitable for applications from R&D to mass production
High precision (<±1.5 μm) and suitable for high pressure force (490 N)
Flip Chip Bonder FC6000H
Flip Chip Bonder
FC6000H
Features
For high-end application processors
Both high precision (<±2 μm) and high UPH
PLP Bonder MD5000/MD5000T
PLP Bonder
MD5000/MD5000T
Features
Die bonder/flip chip bonder for panel level packaging (PLP)
High precision (<±1 μm)

Laser Trimming Equipment

Laser ablation enables pattern processing and contaminant removal on glass substrates and wafers.

Laser Micro Trimming Equipment LMT-TR
Laser Micro Trimming Equipment
LMT-TR
Features
Trimming/transfer/metal cutting equipment for micro-LEDs
Laser wavelengths can be switched depending on the work material
Laser spot size can be changed from 2 to 300 μm
Laser Micro Trimming EquipmentLMT-HR
Laser Micro Trimming Equipment
LMT-HR
Features
Laser fuse cutting equipment for analog semiconductors
High-accuracy alignment (<±0.2 μm) equipment
Substrate sizes from 4 to 12 inches are supported

Ultrasonic Transducers

We have a proven track record of the equipment being adopted as a Scanning Acoustic Tomograph sensor for non-destructive and non-contact internal defect inspection of semiconductor chip packages.

Ultrasonic Transducers
Ultrasonic Transducers
Features
Supports a wide range of frequency bands from 20 MHz to 150 MHz, which are required in the semiconductor field
High-precision output can be obtained by using Toray's unique polymer piezoelectric P (VDF-TrFE) film
Pulser receivers, which are modules for sending and receiving pulse signals, are also available

Vacuum Resin Injectors

Ideal for case-type modules and direct potting resin sealing. The equipment supports a wide range of resin properties, from high to low viscosity. It injects two-part epoxy resin into the target workpiece inside the vacuum chamber.

Vacuum Resin Injectors

Vacuum Resin Injectors

Features
Defoaming of resin is performed by stirring the resin under high vacuum
A thin film defoaming tank has been developed for resins that are difficult to defoam, providing high-speed defoaming
Resin is molded via a sequence of manufacturing processes of vacuum defoaming by stirring -> weighing of two agents -> mixing -> vacuum injection
Automatic vacuum defoaming can be performed before stirring and mixing the main agent and curing agent of the epoxy resin
High-precision, wear-resistant ceramic pumps for long-term stable injection volumes

Dispenser Nozzles

Utilizing the processing technologies and experience from manufacturing our synthetic fiber spinning nozzles, we are able to design and manufacture high-precision, high-quality nozzles that are ideal for various applications and liquids.

Dispenser Nozzles
Dispenser Nozzles
Features
Nozzle discharge performance is improved through design and machining that takes the viscosity and surface tension of the liquid into account
Holes can be machined in various shapes, including circular, formed and pipe-shaped
Multi-nozzles with multiple application points are also supported

in-situ Heating TEM

Structural changes during heating can be observed by in-situ TEM using dedicated sample holders.

in-situ Heating TEM
in-situ Heating TEM
Features
Thermal behaviors resulting from heat treatment can be directly observed with high resolution using in-situ Heating TEM holders
Wide temperature range from room temperature to 1,300℃
Precise temperature and time control via the program

Thermal Characterization

We provide technologies that accurately evaluate thermal properties of various materials and devices.

Thermal Characterization (Thermal Conductivity, Thermal Expansion, Thermal Strain)
Thermal Characterization (Thermal Conductivity, Thermal Expansion, Thermal Strain)
Features
Used for high-precision product design and simulation, troubleshooting, and more
High-precision thermal characterization (thermal conductivity, thermal expansion and thermal strain) of actual products with the latest equipment
Amorphous and composite materials such as soft and semi-solid materials can also be measured

Machining Part Materials (PPS/PEEK/PAI Rods and Plates)

In order to achieve cutting machining with high precision and high efficiency, we offer a wide range of products that can be adapted to the required specifications, from hardness and wear resistance to high heat resistance and chemical resistance.

PPS Super Engineering Plastic Materials
PPS Super Engineering
Plastic Materials
Features
High dimensional stability due to the material's low linear expansion coefficient and low water absorption
Excellent chemical resistance to organic solvents, strong inorganic acids and strong alkalis
Lower cost than PEEK when the use with hot water is not required
Alternative materials for PFAS can be proposed
PEEK Super Engineering Plastic Materials
PEEK Super Engineering
Plastic Materials
Features
Excellent high temperature water resistance for continuous use in steam from 200℃ to 260℃
Extremely high chemical resistance to acids and alkalis in high-temperature conditions
High combustibility, so very little smoke or toxic gases are generated by combustion
PAI Super Engineering Plastic Materials
PAI Super Engineering
Plastic Materials
Features
Highest mechanical strength in non-filled (non-reinforced) plastics
Self-lubricating and can be used as a sliding part without a lubricant at high temperatures above 200℃
Excellent abrasion resistance at temperatures up to 200℃
Used for applications such as inspection and reliability testing device sockets and jigs, and burn-in reliability testing

Cleaning Cloths

To achieve the high level of cleanliness for production and inspection processes, microfibers with a diameter of 2 microns create a structure with a high number of fibers and gaps per unit area.

TORAYSEE™
TORAYSEE™
Features
Excellent wiping performance with our special microfibers
Low level of dust generation and high lint-free capacity
High cleanliness with special heat cutting process and washing process
High level of water and oil absorption by capillary action

Resist Removal Solvents (DMSO)

DMSO is a highly safe aprotic polar solvent that dissolves most organic and inorganic compounds. It is used as a cleaning solution and releasing agent for semiconductors and electronic components.

Dimethyl Sulfoxide (DMSO)
Dimethyl Sulfoxide (DMSO)
Features
The content of metal impurities is controlled with the most stringent levels in the world
Proven track record of adoption in many semiconductor applications

Semiconductor Inspection Systems (Wafer Inspection System/Luminescence Defect Inspection System)

The INSPECTRA™ Series enables high-speed, high-sensitivity inspection of all wafers, from front-end to back-end processes in semiconductor manufacturing. The INSPECTRA™ PL Series automatically detects crystal defects, cracks and luminescence defects that were not visible in visible light appearance inspection.

Wafer Inspection SystemINSPECTRA™Series
Wafer Inspection System
INSPECTRA™Series
Features
Improved inspection performance and enhanced system reliability and usability compared to conventional models
High-magnification inspection achieves twice the inspection speed of conventional models
A wide range of products are available, including types that support wafer inspection after dicing
Luminescence Defect Inspection System INSPECTRA™ PL Series
Luminescence Defect Inspection System
INSPECTRA™ PL Series
Features
Crystal defects are detected and classified at high speed and with high sensitivity using TASMIT’s own optical systems and inspection algorithms
The system can even be used for pattern process
Killer defects can be detected with combined visible light inspection and PL inspection
Wafer Internal Inspection System INSPECTRA™ IR Series
Wafer Internal Inspection System
INSPECTRA™ IR Series
Features
The system can be used for both infrared and visible light defect inspections
High-sensitivity detection of fine defects DSI (Die to Statistical Image) algorithms
For infrared light inspection, the use of high-sensitivity cameras speeds up wafer internal inspection
Visible light inspection is also available for a wide range of inspection needs
Overlay Measurement System  OM-7000H
Overlay Measurement System
OM-7000H
Features
High-precision measurement of wafer bonding misalignment and top-to-bottom alignment of wafers
Fully automatic measurement
Supports both transmission and reflection measurements

Oxygen Analyzer

Toray's unique zirconia sensor technology provides accurate and reliable measurement of oxygen concentration. A wide range of oxygen concentrations from trace oxygen to 100% can be monitored in the manufacturing device chamber processing room.

Oxygen Analyzer (for Wafer Process)
Oxygen Analyzer (for Wafer Process)
Features
Multi-point measurement is supported, enabling simultaneous measurement at up to 8 points
Concentration can be displayed at ppm levels
The sampling method is compatible with pump suction types and diffuse types used for vacuum measurement
The oxygen sensor is specially processed for greater durability
Oxygen Analyzer (for Packaging and Testing Process)
Oxygen Analyzer (for Packaging and Testing Process)
Features
Supports a wide range of measurements from ppm levels to 100%
The oxygen sensor is specially processed for greater durability against sensor deterioration

Inkjet Nozzles/ Vacuum Plates/Apertures,
Orifices and Collimators

We custom manufacture a variety of precision hole processing parts, such as inkjet nozzles, vacuum plates, apertures, collimators and orifices, which are essential for semiconductor manufacturing processes.

Inkjet Nozzles
Inkjet Nozzles
Features
Machining of small diameter holes for high-definition coating (minimum hole diameter: Ø0.1 μm)
Machining accuracy at the sub-micron scale
Smooth finishing of internal hole surfaces at nano-scale surface roughness
Custom manufacturing of your desired hole shape
Vacuum Plates
Vacuum Plates
Features
High-precision micro-holes, positional accuracy and high flatness for uniform suction
Suction marks and wrinkles on products can be prevented
Custom-made, flexible design for suction areas
Apertures, Orifices and Collimators
Apertures, Orifices and Collimators
Features
Supports deep hole machining of ultra-micro holes (example: hole diameter Ø0.003 mm and thickness 0.010 mm)
Supports hole diameters from Ø0.1 μm
Compatible with various materials including minor metals such as molybdenum, tungsten, titanium and tantalum

Production Management System

A production management system created through resolving Toray Group's manufacturing site challenges. By sharing a wide variety of data on production activities, it supports planning, execution and evaluation.

TONOPS™ Production Management System

TONOPS™ Production Management System

Features
Semi-packaged system with a wide variety of templates
Detailed and flexible customization
Integration with various production plants and automation equipment is supported

Water Treatment Membranes

We provide comprehensive water treatment solutions utilizing the latest products and technologies in brackish water treatment, seawater desalination, wastewater reclamation and various special applications.

Reverse Osmosis (RO) Membranes
Reverse Osmosis (RO) Membranes
Features
High neutral molecule rejection (boron, silica, etc.) (TBW-HR Series)
A wide range of products are available for various processes (high rejection model, energy saving model, etc.)
Ultrafiltration (UF) Membranes
Ultrafiltration (UF) Membranes
Features
Toray's proprietary membrane fabrication technology achieves high permeability (small footprint) high mechanical strength and high durability (long life)
Nominal pore size of 0.01 μm enables effective removal of suspended solids and microorganisms
Membrane Bioreactor (MBR)
Membrane Bioreactor (MBR)
Features
Better quality of treated water and significantly smaller footprint compared to the conventional activated sludge treatment process
NHP210 and NHPA Series that use flat sheet membrane elements without supporting plates
Module weight reduction and high membrane packing density (space saving) due to the improvement of flat sheet membrane elements

Pure Water TOC Analyzer

Fast, accurate automated measurement of total organic carbon in pure water. The analyzer is used to determine the reusability of pure water used in the cleaning process and control the water quality of pure water in semiconductor manufacturing processes.

Pure Water TOC Analyzer
Pure Water TOC Analyzer
Features
High-speed response (90% response within five minutes) with continuous measurement using wet UV oxidation/CO2 detection system
The auto zero and automatic diagnosis functions enable stable measurements over the long-term