News
Feb 13, 2025
Toray to Exhibit at SEMICON Korea 2025
Dec 4, 2024
Launch of TRENG-PLP Coater
~Panel Level Coater for Advanced Semiconductor Packaging~
~Panel Level Coater for Advanced Semiconductor Packaging~
Nov 11, 2024
Exhibit at “SEMICON Europa 2024”
Oct 23, 2024
Toray Jointly Develops High-Speed Mounting Technology to Expand Silicon Photonics, Demonstrates Industry-First Laser Transfer and Bonding Technology to Reduce Data Center Power Loads
Sep 18, 2024
Participation and Presentation at the International Symposium on Microelectronics (IMAPS 2024)
May 22, 2024
Toray Commercializes PFAS-free Mold Release Film that Slashes Process Contamination and Boosts Advanced Semiconductor Products Capacity Utilization Rates
Apr 16, 2024
Development of Packaging Technology for Ultra-Thin Semiconductor Chips
- Reduced Energy Consumption and Improved Production Efficiency -
- Reduced Energy Consumption and Improved Production Efficiency -
Apr 10, 2024
Advantest & Toray Engineering Establish Technical Partnership
Joint Capabilities to Enhance MicroLED Display Manufacturing Efficienc
Joint Capabilities to Enhance MicroLED Display Manufacturing Efficienc
Mar 15, 2024
Toray Develops Hybrid Bonding Insulating Resin that Helps Enhance Yields and Reliability in High-Density Semiconductor Packaging
Dec 5, 2023
Commence Sales of INSPECTRA® SR-IV, Semiconductor Wafer Visual Inspection System with the Industry’s Fastest High-Magnification, High-Accuracy Inspection